The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2012
Filed:
May. 18, 2011
Applicants:
Chua Swee Kwang, Singapore, SG;
Chia Yong Poo, Singapore, SG;
Inventors:
Chua Swee Kwang, Singapore, SG;
Chia Yong Poo, Singapore, SG;
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A stacked semiconductor package includes a substrate and a plurality of semiconductor dice stacked on the substrate. Each semiconductor die includes a recess, and a discrete component contained in the recess encapsulated in a die attach polymer. The stacked semiconductor package also includes interconnects electrically connecting the semiconductor dice and discrete components, and an encapsulant encapsulating the dice and the interconnects.