Company Filing History:
26 out of 38,002 
1 out of 428 Years Active: 2003-2020
Title: Chua Swee Kwang: Innovator in Integrated Circuit Packaging
Introduction
Chua Swee Kwang is a prominent inventor based in Singapore, known for his significant contributions to the field of integrated circuit packaging. With an impressive portfolio of 27 patents, Chua has been instrumental in developing innovative methods that enhance the efficiency and effectiveness of electronic devices.
Latest Patents
One of Chua's latest inventions describes a comprehensive method for packaging integrated circuit chips (die). This innovative process includes providing a base substrate equipped with package level contacts, applying adhesive, and positioning the dies on the adhesive. The method facilitates the electrical connection of the die to the package level contacts, followed by the removal of the substrate's backside to expose those connections. Consequently, this leads to the formation of an essentially true chip scale package. Additionally, multi-chip modules are created by filling gaps between chips with an encapsulant. Notably, this method includes provisions for interconnecting chips through electrical connections between package level contacts within the base substrate. In another embodiment, chips arranged back-to-back are adhered together with through vias formed in aligned saw streets, further enhancing the interconnectedness of the chip assembly.
Career Highlights
Chua has had a distinguished career, holding positions in reputable companies such as Micron Technology Incorporated and Round Rock Research, LLC. His work in these organizations has significantly contributed to advancements in integrated circuit technologies, particularly in packaging innovations.
Collaborations
Throughout his career, Chua has collaborated with talented colleagues, including Chia Yong Poo and Boon Suan Jeung. These partnerships have fostered a collaborative environment that promotes innovative thinking and drives technological advancements in the semiconductor industry.
Conclusion
Chua Swee Kwang's innovative methods in integrated circuit packaging not only showcase his expertise as an inventor but also reflect his commitment to advancing technology in the digital age. With 27 patents to his name, Chua continues to influence the semiconductor industry through his groundbreaking work and collaborations.