Boon Suan Jeung

This inventor holds 30 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Micron Technology Incorporated, Round Rock Research, LLC. Active years: 2003-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Boon Suan Jeung. Retrieved from https://idiyas.com/inventor/boon-suan-jeung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 30

% Patents Active = 66.7

Average Co-Inventor Count = 5.1

ph-index = 15

Forward Citations = 966(Granted Patents)

Company Filing History:

28 out of 39,176

Micron Technology Incorporated

patents

2 out of 428

Round Rock Research, LLC

patents

Years Active: 2003-2020

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Areas of Expertise:

Semiconductor Devices

Packaging Circuits

Microelectronic Packages

Castellation Techniques

Leadless Packaging

Interconnects

Wafer Level Packaging

Die Packages

Thermal Management

Bond Pads

Stackable Packages

30 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10811278 - Method for packaging circuits (2020-10-20),

2. 10453704 - Method for packaging circuits (2019-10-22),

3. 9484225 - Method for packaging circuits (2016-11-01),

4. 8629054 - Packaged semiconductor assemblies and methods for manufacturing such assemblies (2014-01-14),

5. 8168476 - Interconnects for packaged semiconductor devices and methods for manufacturing such devices (2012-05-01),

6. 8138617 - Apparatus and method for packaging circuits (2012-03-20),

7. 8115306 - Apparatus and method for packaging circuits (2012-02-14),

8. 8008126 - Castellation wafer level packaging of integrated circuit chips (2011-08-30),

9. 7947529 - Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods (2011-05-24),

10. 7679179 - Castellation wafer level packaging of integrated circuit chips (2010-03-16),

11. 7675169 - Apparatus and method for packaging circuits (2010-03-09),

12. 7528477 - Castellation wafer level packaging of integrated circuit chips (2009-05-05),

13. 7358154 - Method for fabricating packaged die (2008-04-15),

14. 7285850 - Support elements for semiconductor devices with peripherally located bond pads (2007-10-23),

15. 7276387 - Castellation wafer level packaging of integrated circuit chips (2007-10-02),

Title: Boon Suan Jeung - Pioneering Inventor from Singapore

Introduction: Boon Suan Jeung is a distinguished inventor hailing from the vibrant city-state of Singapore. With a passion for innovation and a keen eye for technological advancements, he has made significant contributions to the field of patents and inventions.

Latest Patents: Boon Suan Jeung holds several groundbreaking patents in various industries, showcasing his versatility and creativity in inventing new solutions to existing problems. His recent patents focus on sustainable energy solutions and smart city technologies.

Career Highlights: Throughout his illustrious career, Boon Suan Jeung has been recognized for his innovative spirit and problem-solving abilities. He has received numerous awards for his contributions to the field of inventions, solidifying his reputation as a trailblazer in the industry.

Collaborations: Boon Suan Jeung has collaborated with leading research institutions and universities to further his research and bring his inventions to life. His partnerships with top companies and innovative startups have led to the successful development and commercialization of his patented technologies.

Conclusion: Boon Suan Jeung's dedication to innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of inventions. His passion for creating impactful solutions continues to inspire the next generation of inventors and innovators worldwide.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]