Ho Kwok Seng

Title: Ho Kwok Seng: Innovator in Circuit Packaging Technology

Introduction

Ho Kwok Seng is a notable inventor based in Singapore, recognized for his contributions to circuit packaging technology. He holds a total of 3 patents that showcase his innovative approaches in the field. His work has significantly impacted the way circuits are packaged, enhancing efficiency and functionality.

Latest Patents

Ho Kwok Seng's latest patents include an "Apparatus and method for packaging circuits" and a "Method for fabricating packaged die." These patents describe methods for forming edge contacts on a die without increasing its height. The edge contacts are strategically positioned on the periphery of the die and within the saw streets. Each edge contact connects to a bond pad of adjacent dies, allowing for efficient separation during the manufacturing process. The patents also detail the formation of a recess in the saw street, which is created using a mechanical cutter, followed by the deposition of contact material to establish the edge contacts.

Career Highlights

Throughout his career, Ho has worked with prominent companies such as Micron Technology Incorporated and Round Rock Research, LLC. His experience in these organizations has allowed him to refine his skills and contribute to significant advancements in circuit packaging technology.

Collaborations

Ho has collaborated with talented individuals in the industry, including Chia Yong Poo and Boon Suan Jeung. These collaborations have fostered a creative environment that has led to innovative solutions in their projects.

Conclusion

Ho Kwok Seng is a distinguished inventor whose work in circuit packaging technology has made a lasting impact. His patents reflect his commitment to innovation and efficiency in the field.