The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2006
Filed:
Oct. 06, 2005
Minori Noguchi, Yokohama, JP;
Yoshimasa Ohshima, Yokohama, JP;
Hidetoshi Nishiyama, Fujisawa, JP;
Shunichi Matsumoto, Yokohama, JP;
Yukio Kembo, Shakujii-machi, JP;
Ryouji Matsunaga, Chigasaki, JP;
Keiji Sakai, Tokyo, JP;
Takanori Ninomiya, Hiratsuka, JP;
Tetsuya Watanabe, Honjo, JP;
Hisato Nakamura, Kamisato-machi, JP;
Takahiro Jingu, Takasaki, JP;
Yoshio Morishige, Honjo, JP;
Shuichi Chikamatsu, Kounosu, JP;
Minori Noguchi, Yokohama, JP;
Yoshimasa Ohshima, Yokohama, JP;
Hidetoshi Nishiyama, Fujisawa, JP;
Shunichi Matsumoto, Yokohama, JP;
Yukio Kembo, Shakujii-machi, JP;
Ryouji Matsunaga, Chigasaki, JP;
Keiji Sakai, Tokyo, JP;
Takanori Ninomiya, Hiratsuka, JP;
Tetsuya Watanabe, Honjo, JP;
Hisato Nakamura, Kamisato-machi, JP;
Takahiro Jingu, Takasaki, JP;
Yoshio Morishige, Honjo, JP;
Shuichi Chikamatsu, Kounosu, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi High-Technologies Corporation, Tokyo, JP;
Abstract
A defect inspection method includes radiating an illumination slit-shaped beam having lights substantially parallel to a longitudinal direction to a substrate having circuit patterns in a direction inclined at a predetermined gradient relative to the direction of a line normal to the substrate and inclined at a predetermined gradient on a surface with respect to a group of main straight lines of the circuit patterns with its longitudinal direction oriented almost perpendicularly to a direction of a movement of the substrate. Scattered light reflected by a defect such as a foreign particle existing on the illuminated substrate is received and converted into a detection signal by using an image sensor, and defect judging is effected of an extracted a signal indicating a defect such as a foreign particle on the basis of the detection signal output.