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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6975032 B1

PDFFull Text
Date of Patent:
Dec. 13, 2005

Filed:

Dec. 16, 2002

Copper recess process with application to selective capping and electroless plating

Applicants:

Shyng-tsong Chen, Patterson, NY (US);

Timothy J. Dalton, Ridgefield, CT (US);

Kenneth M. Davis, Newburgh, NY (US);

Chao-kun HU, Somers, NY (US);

Fen F. Jamin, Wappingers Falls, NY (US);

Steffen K. Kaldor, Fishkill, NY (US);

Mahadevaiyer Krishnan, Hopewell Junction, NY (US);

Kaushik Kumar, Beacon, NY (US);

Michael F. Lofaro, Milton, NY (US);

Sandra G. Malhotra, Beacon, NY (US);

Chandrasekhar Narayan, Hopewell Junction, NY (US);

David L. Rath, Stormville, NY (US);

Judith M. Rubino, Ossining, NY (US);

Katherine L. Saenger, Ossining, NY (US);

Andrew H. Simon, Fishkill, NY (US);

Sean P. E. Smith, Hopewell Junction, NY (US);

Wei-tsu Tseng, Hopewell Junction, NY (US);

Inventors:

Shyng-Tsong Chen, Patterson, NY (US);

Timothy J. Dalton, Ridgefield, CT (US);

Kenneth M. Davis, Newburgh, NY (US);

Chao-Kun Hu, Somers, NY (US);

Fen F. Jamin, Wappingers Falls, NY (US);

Steffen K. Kaldor, Fishkill, NY (US);

Mahadevaiyer Krishnan, Hopewell Junction, NY (US);

Kaushik Kumar, Beacon, NY (US);

Michael F. Lofaro, Milton, NY (US);

Sandra G. Malhotra, Beacon, NY (US);

Chandrasekhar Narayan, Hopewell Junction, NY (US);

David L. Rath, Stormville, NY (US);

Judith M. Rubino, Ossining, NY (US);

Katherine L. Saenger, Ossining, NY (US);

Andrew H. Simon, Fishkill, NY (US);

Sean P. E. Smith, Hopewell Junction, NY (US);

Wei-tsu Tseng, Hopewell Junction, NY (US);

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorneys:

Gibb I.P. Law Firm, LLC

Lisa Jaklitsch, Esq.

Primary Examiner:

Roy Potter

Int. Cl.
CPC ...
H01L023/48 ;
U.S. Cl.
CPC ...
Abstract

An integrated circuit structure is disclosed that has a layer of logical and functional devices and an interconnection layer above the layer of logical and functional devices. The interconnection layer has a substrate, conductive features within the substrate and caps positioned only above the conductive features.

Find Patent Forward Citations

Chen, Shyng-Tsong. (2005). Copper recess process with application to selective capping and electroless plating (U.S. Patent No. 6975032). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6975032

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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