Sean P E Smith

Title: Innovations of Sean P E Smith

Introduction

Sean P E Smith is a notable inventor based in Hopewell Junction, NY (US). He has made significant contributions to the field of technology, particularly in the area of metal cap processes for copper interconnects. With a total of 6 patents to his name, Smith's work has had a considerable impact on manufacturing processes.

Latest Patents

Among his latest patents is the "Manufacturable CoWP metal cap process for copper interconnects," which involves an aqueous seeding solution of palladium acetate, acetic acid, and chloride. This innovative method allows for the electroless plating of a CoWP alloy on copper in a reproducible manner that is effective for manufacturing. The process begins with the deposition of a seed layer of palladium (Pd) on the copper using the aqueous seeding solution. Following this, a complexing solution is applied to eliminate any Pd ions that may have adsorbed on surfaces other than the copper. Finally, a plating solution containing cobalt (Co), tungsten (W), and phosphorous (P) is used to deposit a layer of CoWP on the Pd seed and copper.

Career Highlights

Sean P E Smith has built a successful career at International Business Machines Corporation (IBM). His work at IBM has allowed him to explore and develop innovative solutions that enhance manufacturing processes in the technology sector.

Collaborations

Throughout his career, Smith has collaborated with notable colleagues, including Mahadevaiyer Krishnan and Donald Francis Canaperi. These collaborations have contributed to the advancement of his research and the successful development of his patents.

Conclusion

Sean P E Smith is a distinguished inventor whose work in the field of metal cap processes for copper interconnects has led to significant advancements in manufacturing technology. His contributions continue to influence the industry and pave the way for future innovations.