The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2007
Filed:
Dec. 22, 2004
Darryl D. Restaino, Modena, NY (US);
Donald F. Canaperi, Bridgewater, CT (US);
Judith M. Rubino, Ossining, NY (US);
Sean P. E. Smith, Hopewell Junction, NY (US);
Richard O. Henry, Wappingers Falls, NY (US);
James E. Fluegel, Rhinebeck, NY (US);
Mahadevaiyer Krishnan, Hopewell Junction, NY (US);
Darryl D. Restaino, Modena, NY (US);
Donald F. Canaperi, Bridgewater, CT (US);
Judith M. Rubino, Ossining, NY (US);
Sean P. E. Smith, Hopewell Junction, NY (US);
Richard O. Henry, Wappingers Falls, NY (US);
James E. Fluegel, Rhinebeck, NY (US);
Mahadevaiyer Krishnan, Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method to electrolessly plate a CoWP alloy on copper in a reproducible manner that is effective for a manufacturable process. In the method, a seed layer of palladium (Pd) is deposited on the copper by an aqueous seeding solution of palladium acetate, acetic acid and chloride. Thereafter, a complexing solution is applied to remove any Pd ions which are adsorbed on surfaces other than the copper. Finally, a plating solution of cobalt (Co), tungsten (W) and phosphorous (P) is applied to the copper so as to deposit a layer of CoWP on the Pd seed and copper.