Ossining, NY, United States of America

Judith Marie Rubino


Average Co-Inventor Count = 5.7

ph-index = 10

Forward Citations = 995(Granted Patents)


Company Filing History:


Years Active: 2001-2008

where 'Filed Patents' based on already Granted Patents

19 patents (USPTO):

Title: Judith Marie Rubino: A Pioneer in Copper Interconnect Technology

Introduction:

Judith Marie Rubino is an accomplished inventor based in Ossining, NY, with a remarkable portfolio of 19 patents. Her innovative contributions, particularly in the field of semiconductor technology, have garnered significant attention, highlighting her expertise in improving the reliability and performance of copper interconnects in integrated circuits.

Latest Patents:

Among her latest inventions is a patented method for reducing electromigration and stress-induced migration of copper wires through a strategic surface coating. The core idea involves the application of a 1-20 nm thick metal layer on the free surface of patterned copper conducting lines prior to depositing the interlevel dielectric. This thin coating not only provides protection against oxidation and interface diffusion, which are major causes of metal line failures, but also enhances adhesion strength between the copper and dielectric materials. By employing processes such as electroless metal coatings and selective deposition techniques, Rubino’s invention aims to improve the longevity and yield of copper interconnects in semiconductor manufacturing.

Career Highlights:

Judith has had an impressive career working with notable companies such as IBM and Intermec IP Corporation. Her experience within these institutions has played a crucial role in shaping her innovative approach to addressing challenges in microelectronics.

Collaborations:

Throughout her career, Judith has collaborated with esteemed professionals, including Carlos Juan Sambucetti and Daniel C. Edelstein. These partnerships have facilitated the development of significant advancements in her field, showcasing the power of teamwork in innovation.

Conclusion:

Judith Marie Rubino’s contributions to the field of semiconductor technology through her numerous patents demonstrate her commitment to pushing the boundaries of innovation. Her groundbreaking work on copper interconnects not only enhances the reliability of electronic components but also marks a significant milestone in the evolution of semiconductor manufacturing practices.

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