The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2002

Filed:

Jul. 20, 1998
Applicant:
Inventors:

Gerald Yin, Cupertino, CA (US);

Arnold Kolandenko, San Francisco, CA (US);

Hong Ching Shan, San Jose, CA (US);

Peter Loewenhardt, San Jose, CA (US);

Chii Lee, Fremont, CA (US);

Yan Ye, Campbell, CA (US);

Xueyan Qian, Milpitas, CA (US);

Songlin Xu, Fremont, CA (US);

Arthur Chen, Fremont, CA (US);

Arthur Sato, San Jose, CA (US);

Michael Grimbergen, Redwood City, CA (US);

Diana Ma, Saratoga, CA (US);

John Yamartino, Palo Alto, CA (US);

Chun Yan, Santa Clara, CA (US);

Wade Zawalski, Sunnyvale, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23E 1/648 ;
U.S. Cl.
CPC ...
C23E 1/648 ;
Abstract

The present invention provides an apparatus and method, for plasma assisted processing of a workpiece, which provides for separate control of species density within a processing plasma. The present invention has a processing chamber and at least one collateral chamber. The collateral chamber is capable of generating a collateral plasma and delivering it to the processing chamber. To control the densities of the particle species within the processing chamber the present invention may have: a filter interposed between the collateral chamber and the processing chamber, primary chamber source power, several collateral chambers providing separate inputs to the processing chamber, or combinations thereof. Collateral plasma may be: filtered, combined with primary chamber generated plasma, combined with another collateral plasma, or combinations thereof to separately control the densities of the species comprising the processing plasma.

Published as:
KR20010040736A; US6352049B1;

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