The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2023
Filed:
May. 29, 2020
Taiwan Semiconductor Manufacturing, Co., Ltd., Hsinchu, TW;
Shuen-Shin Liang, Hsinchu, TW;
Chun-I Tsai, Hsinchu, TW;
Chih-Wei Chang, Hsinchu, TW;
Chun-Hsien Huang, Hsinchu, TW;
Hung-Yi Huang, Hsinchu, TW;
Keng-Chu Lin, Chao-Chou Ping-Tung, TW;
Ken-Yu Chang, Hsinchu, TW;
Sung-Li Wang, Zhubei, TW;
Chia-Hung Chu, Taipei, TW;
Hsu-Kai Chang, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
The present disclosure describes a method for forming liner-free or barrier-free conductive structures. The method includes forming a liner-free conductive structure on a cobalt conductive structure disposed on a substrate, depositing a cobalt layer on the liner-free conductive structure and exposing the liner-free conductive structure to a heat treatment. The method further includes removing the cobalt layer from the liner-free conductive structure.