The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2018

Filed:

May. 24, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Niloy Mukherjee, Portland, OR (US);

Niti Goel, Portland, OR (US);

Sanaz K. Gardner, Hillsboro, OR (US);

Pragyansri Pathi, Portland, OR (US);

Matthew V. Metz, Portland, OR (US);

Sansaptak Dasgupta, Hillsboro, OR (US);

Seung Hoon Sung, Beaverton, OR (US);

James M. Powers, Beaverton, OR (US);

Gilbert Dewey, Hillsboro, OR (US);

Benjamin Chu-Kung, Portland, OR (US);

Jack T. Kavalieros, Portland, OR (US);

Robert S. Chau, Beaverton, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06Q 30/02 (2012.01); H01L 21/02 (2006.01); H01L 21/762 (2006.01); H01L 29/08 (2006.01); H01L 29/06 (2006.01); H01L 29/04 (2006.01); H01L 21/8238 (2006.01); H01L 29/78 (2006.01); H01L 29/267 (2006.01); H01L 29/165 (2006.01); H01L 21/8258 (2006.01); H01L 27/092 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02694 (2013.01); H01L 21/02381 (2013.01); H01L 21/02516 (2013.01); H01L 21/02532 (2013.01); H01L 21/02538 (2013.01); H01L 21/02609 (2013.01); H01L 21/02636 (2013.01); H01L 21/02639 (2013.01); H01L 21/76224 (2013.01); H01L 21/823814 (2013.01); H01L 21/823821 (2013.01); H01L 21/823878 (2013.01); H01L 29/045 (2013.01); H01L 29/0653 (2013.01); H01L 29/0847 (2013.01); H01L 29/165 (2013.01); H01L 29/267 (2013.01); H01L 29/7848 (2013.01); H01L 21/8258 (2013.01); H01L 27/0924 (2013.01);
Abstract

Trenches (and processes for forming the trenches) are provided that reduce or prevent crystaline defects in selective epitaxial growth of type III-V or Germanium (Ge) material (e.g., a 'buffer' material) from a top surface of a substrate material. The defects may result from collision of selective epitaxial sidewall growth with oxide trench sidewalls. Such trenches include (1) a trench having sloped sidewalls at an angle of between 40 degrees and 70 degrees (e.g., such as 55 degrees) with respect to a substrate surface; and/or (2) a combined trench having an upper trench over and surrounding the opening of a lower trench (e.g., the lower trench may have the sloped sidewalls, short vertical walls, or tall vertical walls). These trenches reduce or prevent defects in the epitaxial sidewall growth where the growth touches or grows against vertical sidewalls of a trench it is grown in.


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