The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2018
Filed:
Sep. 26, 2017
Globalfoundries Inc., Grand Cayman, KY;
Yanping Shen, Saratoga Springs, NY (US);
Hui Zang, Guilderland, NY (US);
Hsien-Ching Lo, Clifton Park, NY (US);
Yongjun Shi, Clifton Park, NY (US);
Randy W. Mann, Milton, NY (US);
Yi Qi, Niskayuna, NY (US);
Guowei Xu, Ballston Lake, NY (US);
Wei Hong, Clifton Park, NY (US);
Jerome Ciavatti, Mechanicville, NY (US);
Jae Gon Lee, Waterford, NY (US);
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Abstract
Disclosed is a method of forming an integrated circuit (IC) structure with multiple non-planar transistors having different effective channel widths. In the method, sacrificial gates are removed from partially completed transistors, creating gate openings that expose sections of semiconductor fins between source/drain regions. Prior to forming replacement metal gates in the gate openings, additional process steps are performed so that, in the resulting IC structure, some transistors have different channel region heights and, thereby different effective channel widths, than others. These steps can include forming isolation regions in the bottoms of some gate openings. Additionally or alternatively, these steps can include filling some gate openings with a sacrificial material, recessing the sacrificial material to expose fin tops within those gate openings, either recessing the fin tops or forming isolation regions in the fin tops, and removing the sacrificial material. Also disclosed is an IC structure formed according to the method.