Melaka, Malaysia

Zi Song Poh

USPTO Granted Patents = 4 

Average Co-Inventor Count = 3.2

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Melaka, MY (2015)
  • Petaling Jaya, MY (2017)

Company Filing History:


Years Active: 2015-2017

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4 patents (USPTO):

Title: Innovations of Inventor Zi Song Poh

Introduction

Zi Song Poh is a notable inventor based in Melaka, Malaysia. He has made significant contributions to the field of semiconductor technology, holding a total of four patents. His work focuses on developing advanced substrates for integrated circuit packages, which are essential for modern electronic devices.

Latest Patents

One of his latest patents is the Universal BGA Substrate. This innovative substrate is designed for assembling ball grid array (BGA) type integrated circuit packages. It features a non-conducting matrix with an array of conducting vias extending between the top and bottom surfaces. The substrate includes multiple instances of different types of fiducial pairs on the top surface, indicating the locations of different via sub-arrays for various BGA package sizes. This design allows for the same substrate to be used across different BGA package sizes, eliminating the need for multiple substrate designs.

Another significant patent is the Substrate with Electrically Isolated Bond Pads. This substrate is intended for semiconductor device assembly and has an electrically insulating body with a die mounting surface and a grid array surface. It contains an array of external electrical connection pads on the grid array surface, with substrate bond pads located on the die mounting surface. The interconnects within the insulating body selectively connect the bond pads to the external pads, while tertiary bond pads are electrically isolated from the external connection pads.

Career Highlights

Zi Song Poh has worked with prominent companies in the semiconductor industry, including Freescale Semiconductor, Inc. and NXP USA, Inc. His experience in these organizations has contributed to his expertise in developing innovative semiconductor solutions.

Collaborations

Throughout his career, Zi Song Poh has collaborated with talented individuals such as Chee Seng Foong and Lee Fee Ngion. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Zi Song Poh's contributions to semiconductor technology through his patents and collaborations highlight his innovative spirit and dedication to advancing the field. His work continues to influence the design and functionality of electronic devices today.

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