The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Jul. 17, 2014
Chee Seng Foong, Sg Buloh, MY;
Lee Fee Ngion, Melaka, MY;
Navas Khan Oratti Kalandar, Petaling Jaya, MY;
Zi Song Poh, Melaka, MY;
Chee Seng Foong, Sg Buloh, MY;
Lee Fee Ngion, Melaka, MY;
Navas Khan Oratti Kalandar, Petaling Jaya, MY;
Zi Song Poh, Melaka, MY;
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Abstract
A method of forming a pillar bump includes feeding a bond wire in a capillary. The capillary has a hole portion and a chamfer section arranged downstream of the hole portion. The hole portion has a length along a feed direction of the bond wire that is greater than a maximum diameter of the hole portion. The method further includes performing an electric flame off (EFO) on a free end of the bond wire extending from the chamfer section to form a free air ball (FAB), tensioning the bond wire and applying a vacuum to the capillary to withdraw a portion of the FAB back into the capillary to substantially fill the hole portion for forming a tower, attaching the FAB to a bonding site, and at least partially removing the capillary from the bonding site and breaking the bond wire above the tower.