Freescale Semiconductor,inc.

Nxp USA, Inc.

Zi Song Poh

Chee Seng Foong

Lee Fee Ngion

Lan Chu Tan

Wai Yew Lo

Navas Khan Oratti Kalandar

Kai Yun Yow

Ly Hoon Khoo

Chin Teck Siong

Wen Shi Koh

A universal substrate for assembling ball grid array (BGA) type integrated circuit packages has a non-conducting matrix, an array of conducting vias extending between top and bottom surfaces of the matrix, and one or more instances of each of two or more different types of fiducial pairs on the top surface of the matrix. Each instance of each different fiducial pair indicates a location of a different via sub-array of the substrate for a different BGA package of a particular package size. The same substrate can be used to assemble BGA packages of different size, thereby avoiding having to design a different substrate for each different BGA package size.

Universal BGA substrate

A method of forming a pillar bump includes feeding a bond wire in a capillary. The capillary has a hole portion and a chamfer section arranged downstream of the hole portion. The hole portion has a length along a feed direction of the bond wire that is greater than a maximum diameter of the hole portion. The method further includes performing an electric flame off (EFO) on a free end of the bond wire extending from the chamfer section to form a free air ball (FAB), tensioning the bond wire and applying a vacuum to the capillary to withdraw a portion of the FAB back into the capillary to substantially fill the hole portion for forming a tower, attaching the FAB to a bonding site, and at least partially removing the capillary from the bonding site and breaking the bond wire above the tower.

Method of forming pillar bump

A substrate for use in semiconductor device assembly has an electrically insulating body with a die mounting surface and an opposite grid array surface. An array of external electrical connection pads is located in the grid array surface. Substrate bond padsare located in the die mounting surface. Interconnects in the insulating body selectively interconnect the substrate bond padsto the external electrical connection pads. Tertiary bond pads are located in the die mounting surface and are electrically isolated from the external electrical connection pads.

Substrate with electrically isolated bond pads

A method of attaching a bond wire to first and second electrical contact pads includes holding the bond wire in a capillary, wherein a first end of the bond wire extends out of an opening in the capillary, attaching the first end of the bond wire to the first electrical contact pad using a ball bonding technique, moving a second end of the bond wire toward the second electrical contact pad after the attachment of the first end of the bond wire, performing an electric flame off on the second end of the bond wire without forming a free air ball, and attaching the second end of the bond wire to the second electrical contact pad after the EFO on the second end of the bond wire.

Insulated wire bonding with EFO before second bond

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Melaka, Malaysia

Zi Song Poh