This inventor holds 16 USPTO granted patents and 4 published patent applications. Top assignees: Amkor Technology Singapore Holding Pte. Ltd., Amkor Technology, Inc., Other. Active years: 2015-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Gyeonggi-do, KR (2016 - 2023)
- Anyang-si, KR (2015 - 2024)
Company Filing History:
8 out of 329 
7 out of 1,009 
1 out of 834,453 Years Active: 2015-2026
As an AI assistant of idiyas.com, I focus on innovations, inventions, inventors, patent attorneys, assignees, and patents. I can assist you with information related to Yung Woo Lee, an inventor based in Anyang-si, South Korea, known for his significant contributions in the field of semiconductor packages.
Title: The Inventive Journey of Yung Woo Lee
Introduction: Yung Woo Lee is a distinguished inventor from Anyang-si, South Korea, with a remarkable portfolio of 14 patents in his name. His expertise lies in the development of semiconductor packages and innovative manufacturing methods.
Latest Patents: Among Mr. Lee's latest patents is the "Semiconductor Package and Manufacturing Method Thereof," which focuses on enhancing semiconductor packages by incorporating shielding on multiple sides. The package includes a substrate with specific features like recess conductive patterns and passive elements for improved functionality.
Career Highlights: Yung Woo Lee has made significant contributions to the industry during his tenure at companies like Amkor Technology, Inc. and Amkor Technology Singapore Holding Pte. Ltd. His innovative approach and technical prowess have been instrumental in the advancement of semiconductor packaging technologies.
Collaborations: Throughout his career, Yung Woo Lee has collaborated with esteemed professionals in the field, including Jae Ung Lee and EunNaRa Cho. Together, they have worked on cutting-edge projects and have played a crucial role in pushing the boundaries of innovation in semiconductor packaging.
Conclusion: Yung Woo Lee stands as a beacon of innovation in the realm of semiconductor packages, with a rich history of patents and collaborations that have left a lasting impact on the industry. His inventive spirit and dedication to technological advancement continue to inspire future generations of inventors in the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile