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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10144634 B1

PDFFull Text
Date of Patent:
Dec. 04, 2018

Filed:

Nov. 07, 2017

Semiconductor package and manufacturing method thereof

Applicant:

Amkor Technology, Inc., Tempe, AZ (US);

Inventors:

Jae Ung Lee, Seoul, KR;

Byong Jin Kim, Bucheon-si, KR;

Young Seok Kim, Seoul, KR;

Wook Choi, Seoul, KR;

Seung Jae Yoo, Cheongju-si, KR;

Yung Woo Lee, Anyang-si, KR;

EunNaRa Cho, Seoul, KR;

Dong Hyun Bang, Seoul, KR;

Assignee:

Amkor Technology, Inc., Tempe, AZ (US);

Attorney:

McAndrews, Held & Malloy, Ltd.

Primary Examiner:

Caleen Sullivan

Int. Cl.
CPC ...
B81B 3/00 (2006.01); B81C 1/00 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/28 (2006.01); H01L 21/56 (2006.01); H01L 23/055 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0072 (2013.01); B81C 1/00666 (2013.01); H01L 23/055 (2013.01); H01L 25/065 (2013.01); H01L 21/568 (2013.01); H01L 23/28 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/562 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/16152 (2013.01);
Abstract

A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and a method of manufacturing thereof, that comprises a first semiconductor die, a plurality of adhesive regions spaced apart from each other on the first semiconductor die, and a second semiconductor die adhered to the plurality of adhesive regions.

Find Patent Forward Citations

Lee, Jae. (2018). Semiconductor package and manufacturing method thereof (U.S. Patent No. 10144634). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10144634

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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