The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2017
Filed:
May. 09, 2016
Applicant:
Amkor Technology, Inc., Tempe, AZ (US);
Inventors:
Jae Ung Lee, Seoul, KR;
Byong Jin Kim, Bucheon-si, KR;
Young Seok Kim, Seoul, KR;
Wook Choi, Seoul, KR;
Seung Jae Yoo, Cheongju-si, KR;
Yung Woo Lee, Anyang-si, KR;
EunNaRa Cho, Seoul, KR;
Dong Hyun Bang, Seoul, KR;
Assignee:
AMKOR TECHNOLOGY, INC., Tempe, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 23/31 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0072 (2013.01); B81C 1/00666 (2013.01); H01L 21/568 (2013.01); H01L 23/28 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01);
Abstract
A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and a method of manufacturing thereof, that comprises a first semiconductor die, a plurality of adhesive regions spaced apart from each other on the first semiconductor die, and a second semiconductor die adhered to the plurality of adhesive regions.