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For the Inventor, By the Inventor

Hsinchu, Taiwan

Yung-Shih Cheng

This inventor holds 14 USPTO granted patents and 19 published patent applications. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yung-Shih Cheng. Retrieved from https://idiyas.com/inventor/yung-shih-cheng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 14 

% Patents Active = 92.9

Average Co-Inventor Count = 3.1

ph-index = 2

Forward Citations = 262(Granted Patents)


Company Filing History:

goldMedal12 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal2 out of 481 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2014-2026

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14 patents (USPTO):Explore Patents
1. 12720837 - Integrated circuit device and manufacturing method thereof (2026-08-25),
2. 12543566 - Semiconductor devices and method for forming the same (2026-02-03),
3. 12538794 - Increasing contact areas of contacts for MIM capacitors (2026-01-27),
4. 12230603 - Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layer (2025-02-18),
5. 12165947 - Semiconductor devices and method for forming the same (2024-12-10),
6. 12142574 - Semiconductor devices and methods of manufacture (2024-11-12),
7. 12074107 - Structure and method of forming a semiconductor device with resistive elements (2024-08-27),
8. 11923295 - Interconnect level with high resistance layer and method of forming the same (2024-03-05),
9. 11908829 - Integrated circuit package and method of forming same (2024-02-20),
10. 11764143 - Increasing contact areas of contacts for MIM capacitors (2023-09-19),
11. 11756924 - Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layer (2023-09-12),
12. 11437313 - Structure and method of forming a semiconductor device with resistive elements (2022-09-06),
13. 9099530 - Methods of patterning small via pitch dimensions (2015-08-04),
14. 8728332 - Methods of patterning small via pitch dimensions (2014-05-20),

Title: The Innovative Journey of Yung-Shih Cheng

Introduction: Yung-Shih Cheng, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Cheng's latest patents include advancements in semiconductor technology, renewable energy solutions, and artificial intelligence systems, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights: With a career spanning over three decades, Yung-Shih Cheng has held key roles in leading tech companies, where he spearheaded research and development projects that have shaped the industry. His innovative spirit and dedication to pushing boundaries have earned him recognition as a trailblazer in his field.

Collaborations: Throughout his career, Cheng has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge sharing. His ability to work effectively in multidisciplinary teams has led to the successful development of cutting-edge technologies.

Conclusion: Yung-Shih Cheng's passion for innovation, coupled with his technical expertise and collaborative mindset, continues to drive him towards new discoveries and inventions that have the potential to transform the way we live and work. His legacy as an inventor remains an inspiration to aspiring innovators globally.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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