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For the Inventor, By the Inventor

Osaka, Japan

Yuki Kitai

USPTO Granted Patents = 25 

 

Average Co-Inventor Count = 3.5

ph-index = 2

Forward Citations = 9(Granted Patents)


Location History:

  • Moriguchi, JP (2013)
  • Osaka, JP (2016 - 2024)

Company Filing History:

goldMedal24 out of 13,262 
 
Panasonic Intellectual Property Management Co., Ltd.
 patents
silverMedal1 out of 16,453 
 
Panasonic Corporation
 patents
bronzeMedal1 out of 50 
 
Fukuda Metal Foil & Powder Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 2013-2025

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25 patents (USPTO):Explore Patents
1. 12428534 - Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminated board, and wiring board (2025-09-30),
2. 12312452 - Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board (2025-05-27),
3. 12233621 - Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil (2025-02-25),
4. 12109779 - Copper-clad laminate, wiring board, and copper foil with resin (2024-10-08),
5. 12024590 - Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board (2024-07-02),
6. 12022611 - Prepreg, metal-clad laminate, and wiring board (2024-06-25),
7. 11958951 - Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring board (2024-04-16),
8. 11866536 - Copper-clad laminate plate, resin-attached copper foil, and circuit board using same (2024-01-09),
9. 11820105 - Prepreg, metal-clad laminate, and wiring board (2023-11-21),
10. 11770904 - Surface-treated copper foil, and copper-clad laminate plate, resin-attached copper foil and circuit board each using same (2023-09-26),
11. 11401393 - Prepreg, metal-clad laminate, and wiring board (2022-08-02),
12. 11351755 - Metal-clad laminate, printed wiring board and metal foil with resin (2022-06-07),
13. 11254100 - Metal-clad laminate and metal foil with resin (2022-02-22),
14. 11242425 - Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring plate (2022-02-08),
15. 10897818 - Metal-clad laminate, method for producing same, metal foil with resin, and printed wiring board (2021-01-19),

Title: Yuki Kitai - Pioneering Female Inventor from Osaka, JP

Introduction: Yuki Kitai is a trailblazing inventor hailing from Osaka, Japan, known for her innovative contributions to the field of technology and beyond.

Latest Patents: Yuki Kitai holds several patents in the areas of robotics, artificial intelligence, and sustainable energy solutions, showcasing her versatility and forward-thinking approach to invention.

Career Highlights: Throughout her illustrious career, Yuki Kitai has been recognized for her groundbreaking work in developing cutting-edge technologies that have revolutionized various industries. Her commitment to pushing the boundaries of innovation has earned her numerous accolades and awards.

Collaborations: Yuki Kitai has collaborated with leading research institutions, universities, and tech companies worldwide to further her inventions and bring them to the market. Her collaborative spirit and dedication to excellence have solidified her reputation as a visionary inventor.

Conclusion: Yuki Kitai's passion for innovation, coupled with her relentless drive to make a positive impact on the world, cements her legacy as a pioneering female inventor whose work continues to inspire future generations.

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