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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11866536 B1

PDFFull Text
Date of Patent:
Jan. 09, 2024

Filed:

Dec. 18, 2019

Copper-clad laminate plate, resin-attached copper foil, and circuit board using same

Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Yuki Kitai, Osaka, JP;

Masashi Koda, Fukushima, JP;

Yasunori Hoshino, Osaka, JP;

Atsushi Wada, Osaka, JP;

Mikio Sato, Osaka, JP;

Assignee:

PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka, JP;

Attorney:

GREENBLUM & BERNSTEIN, P.L.C.

Primary Examiner:

Timothy J Thompson

Assistant Examiner:

Amol H Patel

Int. Cl.
CPC ...
C08F 290/06 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); C25D 3/38 (2006.01); C25D 7/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08F 290/062 (2013.01); B32B 5/02 (2013.01); B32B 5/26 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C25D 3/38 (2013.01); C25D 7/00 (2013.01); H05K 1/036 (2013.01); B32B 2250/05 (2013.01); B32B 2255/06 (2013.01); B32B 2255/205 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2457/08 (2013.01); H05K 2201/0355 (2013.01);
Abstract

A copper-clad laminate includes an insulating layer formed of a cured product of a resin composition and a surface treated copper foil in contact with the insulating layer, in which the resin composition contains a compound having at least one group specified in the present application and a crosslinking type curing agent; and the surface treated copper foil is a surface treated copper foil including a finely roughened particle treatment layer of copper on at least one surface side of copper foil.

Find Patent Forward Citations

Kitai, Yuki. (2024). Copper-clad laminate plate, resin-attached copper foil, and circuit board using same (U.S. Patent No. 11866536). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11866536

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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