The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Sep. 28, 2018
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Yasunori Hoshino, Osaka, JP;

Hiroaki Fujiwara, Nara, JP;

Yuki Kitai, Osaka, JP;

Takayoshi Ozeki, Osaka, JP;

Mikio Sato, Osaka, JP;

Masashi Koda, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08J 5/24 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0366 (2013.01); C08J 5/244 (2021.05); C08J 5/249 (2021.05); H05K 1/0373 (2013.01); C08J 2371/00 (2013.01); H05K 2201/0284 (2013.01);
Abstract

One aspect of the present invention relates to a prepreg having a thermosetting resin composition or a semi-cured product of a thermosetting resin composition, and a fibrous base material, in which the thermosetting resin composition contains (A) a thermosetting resin containing a modified polyphenylene ether compound, (B) a first inorganic filler in which a molybdenum compound is present on at least a part of the surface, and (C) a second inorganic filler, a content of (B) the first inorganic filler is 0.1 parts by weight or more and 15 parts by weight or less, and a content of (C) the second inorganic filler is 200 parts by mass or less, with respect to 100 parts by weight of (A) the thermosetting resin, and the fibrous base material is a glass cloth containing quartz glass yarn.


Find Patent Forward Citations

Hoshino, Yasunori. (2026). Prepreg, and metal-clad laminated board and wiring substrate obtained using same (U.S. Patent No. 12581593). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12581593

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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