The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2023

Filed:

Dec. 24, 2019
Applicants:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Fukuda Metal Foil & Powder Co., Ltd., Kyoto, JP;

Inventors:

Yuki Kitai, Osaka, JP;

Takeshi Okamoto, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); H05K 3/38 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H05K 3/389 (2013.01); H05K 1/09 (2013.01); H05K 3/384 (2013.01); H05K 2201/0355 (2013.01);
Abstract

A surface treated copper foil includes: a copper foil; a finely roughened particle treatment layer of copper on at least one surface of the copper foil, the finely roughened particle treatment layer including fine copper particles having a particle size of 40 to 200 nm; a heat resistance treatment layer containing nickel on the finely roughened particle treatment layer; a rust prevention treatment layer containing at least chromium on the heat resistance treatment layer; and a silane coupling agent treatment layer on the rust prevention treatment layer. An amount of nickel attached in the heat resistance treatment layer is 30 to 60 mg/m2.


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