Company Filing History:
Years Active: 2018-2025
Title: Innovator Spotlight: Yu-Yang Shen
Introduction
Yu-Yang Shen is a prominent inventor based in Kaohsiung, Taiwan, recognized for his significant contributions to semiconductor technologies. With a total of seven patents to his name, Yu-Yang has made noteworthy advancements in integrated chip structures and related fields.
Latest Patents
Among his latest innovations, Yu-Yang Shen has developed a patent for a "Stacked substrate structure with inter-tier interconnection." This invention relates to an integrated chip structure featuring a first plurality of interconnects within a first dielectric structure on one substrate and a second plurality of interconnects on another substrate. The design includes a bonding structure that facilitates an inter-tier interconnect structure, enhancing the performance and functionality of semiconductor devices.
Another notable patent from Yu-Yang is the "Ion through-substrate via," which focus on a semiconductor structure incorporating a through-substrate via (TSV). This design features a first doped region that spans from the top surface to the bottom surface of the substrate, creating a conductive path that is critical for efficient electrical communication within semiconductor devices.
Career Highlights
Yu-Yang Shen is affiliated with Taiwan Semiconductor Manufacturing Company Limited (TSMC), one of the world's leading firms in semiconductor manufacturing. His work at TSMC has positioned him at the forefront of cutting-edge technology development, allowing him to harness the potential of his inventions within a collaborative and innovative environment.
Collaborations
Yu-Yang has worked alongside notable colleagues, including Dun-Nian Yaung and Chien-Hsien Tseng. Their collaborations contribute to the rich pool of knowledge and expertise that drives the advancement of semiconductor technologies at TSMC.
Conclusion
Through his inventive spirit and dedication, Yu-Yang Shen continues to lead advancements in the semiconductor industry. His innovative patents not only showcase his talent but also pave the way for the future of integrated chip technologies. As the industry evolves, the impacts of his work and collaborations are sure to be felt for years to come.