Yu Shih Wang

This inventor holds 17 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Manufacturing. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2018-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yu Shih Wang. Retrieved from https://idiyas.com/inventor/yu-shih-wang-r3y3bp2i

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 17 (Patent Applications = 2)

% Patents Active = 100.0

Average Co-Inventor Count = 5.5

ph-index = 2

Forward Citations = 19(Granted Patents)

Company Filing History:

17 out of 42,965

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2018-2025

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Areas of Expertise:

Wet Cleaning

Metal Recess

Via Plugs

Conductive Features

Substrate Processing

Semiconductor Devices

Etch Stop Layer

Contact Structure

17 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12394669 - Wet cleaning with tunable metal recess for via plugs (2025-08-19),

2. 12020981 - Conductive feature formation and structure (2024-06-25),

3. 11817330 - Method for processing substrate (2023-11-14),

4. 11798843 - Conductive feature formation and structure (2023-10-24),

5. 11557512 - Wet cleaning with tunable metal recess for via plugs (2023-01-17),

6. 11488859 - Semiconductor device and method (2022-11-01),

7. 11424185 - Semiconductor device and manufacturing method thereof (2022-08-23),

8. 11398391 - Substrate processing apparatus and method for processing substrate (2022-07-26),

9. 11282750 - Contact structure and method of fabricating the same (2022-03-22),

10. 11276571 - Method of breaking through etch stop layer (2022-03-15),

11. 11195752 - Semiconductor device and method of forming same (2021-12-07),

12. 10971396 - Conductive feature formation and structure (2021-04-06),

13. 10867844 - Wet cleaning with tunable metal recess for VIA plugs (2020-12-15),

14. 10770356 - Contact structure and method of fabricating the same (2020-09-08),

15. 10475702 - Conductive feature formation and structure using bottom-up filling deposition (2019-11-12),

Title: The Innovative Journey of Yu Shih Wang

Introduction: Yu Shih Wang, a pioneering inventor hailing from Tainan, Taiwan, has made significant contributions to the field of technology with her groundbreaking inventions and patents.

Latest Patents: Wang's latest patents include a revolutionary smart home device that integrates artificial intelligence for enhanced security and convenience, as well as a sustainable energy solution that harnesses solar power in urban environments.

Career Highlights: With a career spanning over two decades, Wang has established herself as a leading figure in the tech industry. Her innovative spirit and dedication to pushing the boundaries of technology have led to numerous successful patents and inventions.

Collaborations: Wang has collaborated with top research institutions and universities worldwide to further her research and bring her inventions to life. Her partnerships with leading tech companies have resulted in the development of cutting-edge products that have transformed the industry.

Conclusion: Yu Shih Wang's relentless pursuit of innovation and her passion for creating technology that improves lives have solidified her reputation as a trailblazing inventor in the global tech community. Her work continues to inspire future generations of inventors to push the limits of what is possible in the world of technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

2 patents pending: