The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2022

Filed:

May. 19, 2020
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Po-Yuan Wang, Hsinchu, TW;

Tzu Ang Chiang, Yilan County, TW;

Jian-Jou Lian, Tainan, TW;

Yu Shih Wang, Tainan, TW;

Chun-Neng Lin, Hsinchu County, TW;

Ming-Hsi Yeh, Hsinchu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/683 (2006.01); B08B 3/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67051 (2013.01); B08B 3/02 (2013.01); H01L 21/6708 (2013.01); H01L 21/6715 (2013.01); H01L 21/67115 (2013.01); H01L 21/67248 (2013.01); H01L 21/683 (2013.01);
Abstract

A substrate processing apparatus is provided. The substrate processing apparatus includes a plurality of holding members and at least a first injector. The plurality of holding members are configured to hold a substrate. The substrate includes a front surface and a back surface opposite to the front surface. The first injector is below the holding members and is configured to face the back surface of the substrate. The first injector is displaced from a projection of a center of the substrate from a top view perspective. A method for processing a substrate is also provided.


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