Yoshizo Osumi

Title: Innovations of Yoshizo Osumi

Introduction

Yoshizo Osumi is a prominent inventor based in Kyoto, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of five patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

One of his latest patents describes a semiconductor device that includes a first semiconductor chip and a second semiconductor chip, each supplied with different power-supply voltages. The device features connection bonding wires that link the two chips and a sealing resin that fills the gap between the lead frames. This design ensures that the circumferences of both semiconductor chips are adequately covered. Additionally, the insulating protection film used in the device has a higher electrical breakdown voltage than the sealing resin material. Another patent outlines a semiconductor device that consists of a conductive support member with two die pads. These pads are designed to mount the first and second semiconductor elements, allowing for efficient spatial arrangement and functionality.

Career Highlights

Yoshizo Osumi is currently employed at Rohm Co., Ltd., a company known for its innovative semiconductor solutions. His work at Rohm has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the industry.

Collaborations

Throughout his career, Osumi has collaborated with notable colleagues, including Tomohira Kikuchi and Hiroaki Matsubara. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Yoshizo Osumi's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to impact the industry positively, paving the way for future innovations.