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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11894321 B1

PDFFull Text
Date of Patent:
Feb. 06, 2024

Filed:

Sep. 03, 2021

Semiconductor device with a transmitting insulating element

Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Yoshizo Osumi, Kyoto, JP;

Hiroaki Matsubara, Kyoto, JP;

Tomohira Kikuchi, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

HAMRE, SCHUMANN, MUELLER & LARSON, P.C.

Primary Examiner:

Caleb E Henry

Assistant Examiner:

Dilinh P Nguyen

Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 23/64 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H02P 27/08 (2006.01); B60K 6/22 (2007.10); B60L 50/50 (2019.01);
U.S. Cl.
CPC ...
H01L 23/645 (2013.01); H01L 21/4825 (2013.01); H01L 21/4828 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49575 (2013.01); B60K 6/22 (2013.01); B60L 50/50 (2019.02); B60Y 2200/91 (2013.01); B60Y 2200/92 (2013.01); H02P 27/08 (2013.01);
Abstract

A semiconductor device includes a conductive support member, a first semiconductor element, a second semiconductor element, an insulating element, and a sealing resin. The conductive support member includes a first die pad and a second die pad, which are separated from each other in a first direction. The first die pad and the second die pad overlap each other when viewed along the first direction. When viewed along a thickness direction, a peripheral edge of the first die pad has a first near-angle portion including a first end portion in a second direction orthogonal to both the thickness direction and the first direction. The first near-angle portion is separated from the second die pad in the first direction toward the first end portion in the second direction.

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