The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Sep. 19, 2023
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Yoshizo Osumi, Kyoto, JP;
Hiroaki Matsubara, Kyoto, JP;
Tomohira Kikuchi, Kyoto, JP;
Taro Nishioka, Kyoto, JP;
Assignee:
Rohm Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/40 (2026.01); H10W 44/00 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/481 (2026.01); H10W 44/501 (2026.01); H10W 70/411 (2026.01); H10W 70/442 (2026.01); H10W 90/736 (2026.01); H10W 90/756 (2026.01);
Abstract
A semiconductor device includes a plurality of conductive members including a die pad, a first semiconductor element and a second semiconductor element each located on the die pad, an insulating element electrically connected to the first semiconductor element and the second semiconductor element and insulating the first semiconductor element and the second semiconductor element from each other, and an insulating substrate interposed between the die pad and the insulating element and bonded to the die pad. The insulating element is bonded to the insulating substrate.