The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Jul. 14, 2023
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Tomohira Kikuchi, Kyoto, JP;

Hiroaki Matsubara, Kyoto, JP;

Yoshizo Osumi, Kyoto, JP;

Moe Yamaguchi, Kyoto, JP;

Ryohei Umeno, Kyoto, JP;

Assignee:

Rohm Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 70/40 (2026.01); H10W 72/00 (2026.01); H10W 72/30 (2026.01); H10W 74/10 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 70/429 (2026.01); H10W 74/114 (2026.01); H10W 90/811 (2026.01); H10W 70/417 (2026.01); H10W 72/352 (2026.01); H10W 72/884 (2026.01); H10W 90/736 (2026.01); H10W 90/753 (2026.01); H10W 90/756 (2026.01); H10W 90/759 (2026.01);
Abstract

A semiconductor device includes a semiconductor control element, a first drive element, a second drive element and a first insulating element. The first drive element is spaced apart from the semiconductor control element in a first direction orthogonal to a thickness direction of the semiconductor control element and receives a signal transmitted from the semiconductor control element. The second drive element is spaced apart from the first drive element in a second direction orthogonal to the thickness direction and the first direction and receives a signal transmitted from the semiconductor control element. The first insulating element is located between the semiconductor control element and the first drive element in the first direction. The first insulating element relays a signal transmitted from the semiconductor control element to the first drive element and provides electrical insulation between the semiconductor control element and the first drive element.


Find Patent Forward Citations

Kikuchi, Tomohira. (2026). Semiconductor device (U.S. Patent No. 12696812). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12696812

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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