This inventor holds 18 USPTO granted patents and 1 published patent application, primarily in Flexible Printed Circuits. Top assignee: Kaneka Corporation. Active years: 2014-2019.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Otsu, JP (2014 - 2015)
- Shiga, JP (2014 - 2019)
Company Filing History:
Years Active: 2014-2019
Areas of Expertise:
**Title: Innovator Spotlight on Yoshihide Sekito**
Introduction
Yoshihide Sekito, a distinguished inventor based in Shiga, Japan, holds an impressive portfolio of 18 patents. His contributions to the field of flexible printed circuit boards demonstrate his innovative spirit and dedication to advancing technology in electrical insulation reliability.
Latest Patents
Sekito's recent inventions include:
1. **Reinforcing-plate-integrated flexible printed circuit board** - This invention offers a stiffener-integrated flexible printed circuit board that enhances electrical insulation reliability and ensures that the stiffener remains secure during the reflow process. The board is composed of a stiffener, a thermosetting adhesive, an insulator film, and a wiring-pattern-equipped film, layered strategically for optimal performance.
2. **Conductive-layer-integrated flexible printed circuit board** - This patent presents a conductive-layer-integrated flexible printed circuit board designed to maintain excellent electrical insulation reliability while preventing the electrically conductive layer from detaching during reflow. Similar to the first patent, it comprises an electromagnetic-shielding conductive layer, an insulator film, and a wiring-pattern-equipped film, all layered for effectiveness.
Career Highlights
Yoshihide Sekito is currently employed at Kaneka Corporation, where he applies his expertise to the development of advanced circuit board technologies. His innovative mindset and technical know-how have significantly contributed to the company's growth and commitment to excellence in engineering.
Collaborations
Throughout his career, Sekito has collaborated with talented colleagues such as Masayoshi Kido and Tetsuya Kogiso. These partnerships have fostered a collaborative environment for innovation, driving the development of cutting-edge solutions in the realm of flexible printed circuit boards.
Conclusion
Yoshihide Sekito's work exemplifies the power of creativity and innovation in the field of electronic engineering. With a portfolio of 18 patents, his contributions, particularly in flexible printed circuit board technology, will undoubtedly continue to influence the industry for years to come.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile