The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2016

Filed:

May. 14, 2009
Applicant:

Yoshihide Sekito, Shiga, JP;

Inventor:

Yoshihide Sekito, Shiga, JP;

Assignee:

KANEKA CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 18/75 (2006.01); C08G 18/34 (2006.01); C08G 18/44 (2006.01); C08G 18/66 (2006.01); C08G 73/10 (2006.01); C09D 179/08 (2006.01); G03F 7/027 (2006.01); G03F 7/037 (2006.01); H01B 3/30 (2006.01); H01B 3/40 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
C08G 18/758 (2013.01); C08G 18/348 (2013.01); C08G 18/44 (2013.01); C08G 18/6659 (2013.01); C08G 73/1035 (2013.01); C09D 179/08 (2013.01); G03F 7/027 (2013.01); G03F 7/037 (2013.01); H01B 3/306 (2013.01); H01B 3/40 (2013.01); H05K 3/287 (2013.01);
Abstract

An object of the present invention is to provide: a (a) thermosetting resin composition, a photosensitive resin composition, a resin composition solution, a resin film, and an insulating film, each of which (i) is curable at a low temperature (not more than 200° C.), (ii) has excellent flexibility, electrical insulating reliability, solder heat resistance, and resistance to organic solvent, (iii) causes less warpage of a substrate after curing, and (iv) has excellent adhesiveness to a sealing agent; and a (b) printed wiring board provided with the insulating film mentioned above. The object of the present invention is attainable by using a thermosetting resin composition containing at least a (A) urethane imide oligomer having a terminal carboxylic acid group and a (B) thermosetting resin.


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