The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2016
Filed:
Apr. 26, 2012
Applicants:
Masayoshi Kido, Shiga, JP;
Yoshihide Sekito, Shiga, JP;
Inventors:
Masayoshi Kido, Shiga, JP;
Yoshihide Sekito, Shiga, JP;
Assignee:
KANEKA CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); H05K 1/02 (2013.01); H05K 1/028 (2013.01); H05K 1/0373 (2013.01); H05K 9/003 (2013.01); H05K 1/0393 (2013.01); H05K 2201/0715 (2013.01);
Abstract
A conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film the electromagnetic-shielding conductive layer (A), the insulator film (B), and the wiring-pattern-equipped film (C) being laminated in this order, the insulator film (B) containing at least (a) a binder polymer and (b) spherical organic beads.