The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2015
Filed:
Apr. 26, 2012
Applicants:
Masayoshi Kido, Shiga, JP;
Yoshihide Sekito, Shiga, JP;
Inventors:
Masayoshi Kido, Shiga, JP;
Yoshihide Sekito, Shiga, JP;
Assignee:
Kaneka Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); C09J 9/00 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/02 (2013.01); C09J 9/00 (2013.01); H05K 1/0281 (2013.01); H05K 1/189 (2013.01); H05K 3/0064 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/2009 (2013.01);
Abstract
A stiffener-integrated flexible printed circuit board includes: (A) a stiffener; (B) a thermosetting adhesive; (C) an insulator film; and (D) a wiring-pattern-equipped film, the stiffener (A), the thermosetting adhesive (B), the insulator film (C), and the wiring-pattern-equipped film (D) being laminated in this order, the insulator film (C) containing at least (a) a binder polymer and (b) spherical organic beads. This provides a stiffener-integrated FPC which is excellent in adhesion between a thermosetting adhesive of a stiffener and an insulator film and which is small in warpage.