The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2016

Filed:

Jul. 15, 2009
Applicants:

Koji Okada, Shiga, JP;

Yoshihide Sekito, Shiga, JP;

Inventors:

Koji Okada, Shiga, JP;

Yoshihide Sekito, Shiga, JP;

Assignee:

KANEKA CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); C08G 73/10 (2006.01); C08G 18/08 (2006.01); C08G 18/10 (2006.01); C08G 18/44 (2006.01); C08G 73/16 (2006.01); C08L 79/08 (2006.01); G03F 7/037 (2006.01); H05K 3/28 (2006.01); G03F 7/40 (2006.01);
U.S. Cl.
CPC ...
C08G 73/1035 (2013.01); C08G 18/0823 (2013.01); C08G 18/10 (2013.01); C08G 18/44 (2013.01); C08G 73/105 (2013.01); C08G 73/1007 (2013.01); C08G 73/1042 (2013.01); C08G 73/1046 (2013.01); C08G 73/1067 (2013.01); C08G 73/1071 (2013.01); C08G 73/16 (2013.01); C08L 79/08 (2013.01); G03F 7/037 (2013.01); G03F 7/40 (2013.01); H05K 3/287 (2013.01); H05K 1/0393 (2013.01);
Abstract

An object of the present invention is to provide (a) a polyimide precursor solution which is curable at low temperatures (not more than 200° C.) and which has excellent long-term storage stability, (b) a photosensitive resin composition, a photosensitive resin film, a thermosetting resin composition, and a polyimide insulating film, each of which is obtainable from the polyimide precursor solution and each of which is preferably usable as an insulating material for electric and electronic purposes, and (c) a printed wiring board provided with the insulating film. The above object is achievable by use of a polyimide precursor composition solution containing at least a partially imidized polyimide precursor having a urethane bond.


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