logo

For the Inventor, By the Inventor

Shiga, Japan

Koji Okada

This inventor holds 14 USPTO granted patents and 1 published patent application and 4 EPO patents. Top assignees: Kaneka Corporation, Styron Europe Gmbh. Active years: 2002-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Koji Okada. Retrieved from https://idiyas.com/inventor/koji-okada-4byv922b

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 14 

% Patents Active = 35.7

 

Average Co-Inventor Count = 2.6

ph-index = 5

Forward Citations = 67(Granted Patents)


Location History:

  • Otsu, JP (2003 - 2007)
  • Settsu, JP (2011)
  • Osaka, JP (2008 - 2013)
  • Shiga, JP (2002 - 2016)

Company Filing History:

goldMedal12 out of 1,773 
 
Kaneka Corporation
 patents
silverMedal2 out of 37 
 
Styron Europe Gmbh
 patents

Years Active: 2002-2016

Loading Chart...
Loading Chart...
14 patents (USPTO):Explore Patents
1. 9267004 - Polyimide precursor composition and use thereof (2016-02-23),
2. 8501874 - Thermosetting resin composition, multilayer body using same, and circuit board (2013-08-06),
3. 8426015 - Clear and flame retardant polycarbonate resin film (2013-04-23),
4. 8063245 - Phosphazene compound, photosensitive resin composition and use thereof (2011-11-22),
5. 7960450 - Flame retardant and light diffusing polycarbonate resin composition and light diffusing sheet thereof (2011-06-14),
6. 7521511 - Thermosetting resin composition, multilayer body using same, and circuit board (2009-04-21),
7. 7396898 - Diamine, acid dianhydride, and reactive group containing polyimide composition prepared therefrom and process of preparing them (2008-07-08),
8. 7189488 - Polyimide precursor, manufacturing method thereof, and resin composition using polyimide precursor (2007-03-13),
9. 7141614 - Photosensitive resin composition and photosensitive films and laminates made by using the same (2006-11-28),
10. 7019104 - Diamine novel acid dianhydride and novel polyimide composition formed therefrom (2006-03-28),
11. 6790930 - Process for producing polyimide resin (2004-09-14),
12. 6642393 - Acid anhydrides (2003-11-04),
13. 6605353 - Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide (2003-08-12),
14. 6350845 - Polyimide compositions and novel acid dianhydrides to be used therein (2002-02-26),

Title: The Innovative Journey of Koji Okada

Introduction: Koji Okada, a pioneering inventor hailing from Shiga, Japan, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Koji Okada's recent patents include advancements in robotics, artificial intelligence, and sustainable energy solutions, showcasing his versatility and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Koji Okada has established himself as a leading figure in the field of technology, holding numerous patents and receiving accolades for his innovative work.

Collaborations: Throughout his career, Koji Okada has collaborated with top research institutions, universities, and tech companies to further develop and implement his inventions, fostering a culture of innovation and progress.

Conclusion: Koji Okada's relentless pursuit of innovation and his commitment to pushing the boundaries of technology have solidified his reputation as a visionary inventor, shaping the future of various industries.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…