Kaneka Corporation

Yoshihide Sekito

Masayoshi Kido

Tetsuya Kogiso

Tomohiro Koda

Koji Okada

Kan Fujihara

The present invention provides a stiffener-integrated flexible printed circuit board that has excellent electrical insulation reliability and that prevents the stiffener from being detached during a reflow process. The stiffener-integrated flexible printed circuit board including: (A) a stiffener, (B) a thermosetting adhesive, (C) an insulator film, and (D) a wiring-pattern-equipped film, (A) the stiffener, (B) the thermosetting adhesive, (C) the insulator film, and (D) the wiring-pattern-equipped film being laminated in this order, (C) the insulator film containing at least (a) a binder polymer and (b) a black coloring agent having a reflective range within the infrared range.

Reinforcing-plate-integrated flexible printed circuit board

The present invention provides a conductive-layer-integrated flexible printed circuit board that has excellent electrical insulation reliability and that prevents the electrically conductive layer from being detached during a reflow process. The conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film, (A) the electromagnetic-shielding conductive layer, (B) the insulator film, and (C) the wiring-pattern-equipped film being laminated in this order, (B) the insulator film containing at least (a) a binder polymer and (b) a black coloring agent having a reflective range within the infrared range.

Conductive-layer-integrated flexible printed circuit board

Provided is a black photosensitive resin composition being microfabricatable due to its photosensitivity, allowing a cured film obtainable therefrom to be excellent in flexibility, being small in post-curing warpage of a substrate, being excellent in flame retardancy and electric insulation reliability, allowing a reduction in process contamination due to less outgassing during a reflow process, and avoiding a reduction in film thickness. The black photosensitive resin composition contains at least (A) a binder polymer, (B) a thermosetting resin, (C) a flame retardant substantially insoluble in an organic solvent, (D) a photopolymerization initiator, (E) a black colorant reflecting light having a wavelength falling within an infrared range, and (F) an organic solvent, or contains at least (A) a binder polymer, (B) a thermosetting resin, (G) spherical organic beads, (D) a photopolymerization initiator, (E) a black colorant reflecting light having a wavelength falling within an infrared range, and (F) an organic solvent.

Black photosensitive resin composition and use of same

According to a resin composition for a pigment-containing insulating film which resin composition contains at least a (A) binder polymer and (B) pigment-containing cross-linked polymer particles, it is possible to provide a resin composition for a pigment-containing insulating film which resin composition is excellent in tack property after drying and allows a resultant pigment-containing insulating film to be excellent in flexibility and electrical insulation reliability and to be small in warpage after curing, a resin film for a pigment-containing insulating film, a pigment-containing insulating film, and a printed wiring board provided with a pigment-containing insulating film.

Resin composition for pigment-containing insulating film, and use thereof

In order to provide (A) a photosensitive resin composition which (i) obtains an excellent tack-free property after being applied and dried, (ii) can be subjected to fine processing so as to have photosensitivity, (iii) prepares a cured film having excellent flexibility, flame retardancy, and electrical insulation reliability, and (iv) has small warpage after being cured, (B) a resin film, (C) an insulating film, and (D) an printed wiring board provided with an insulating film, the photosensitive resin composition containing at least (A) binder polymer; (B) cross-linked polymer particles, whose polymer has a urethane bond in its molecule; (C) thermosetting resin; and (D) photo-polymerization initiator is used.

Photosensitive resin composition and use thereof

An object of the present invention is to provide: a (a) thermosetting resin composition, a photosensitive resin composition, a resin composition solution, a resin film, and an insulating film, each of which (i) is curable at a low temperature (not more than 200&#xb0; C.), (ii) has excellent flexibility, electrical insulating reliability, solder heat resistance, and resistance to organic solvent, (iii) causes less warpage of a substrate after curing, and (iv) has excellent adhesiveness to a sealing agent; and a (b) printed wiring board provided with the insulating film mentioned above. The object of the present invention is attainable by using a thermosetting resin composition containing at least a (A) urethane imide oligomer having a terminal carboxylic acid group and a (B) thermosetting resin.

Resin composition and use thereof

The present invention provides a resin composition for an insulating film which resin composition is excellent in tack property after drying and allows a resultant insulating film to be excellent in flexibility and electrical insulation reliability and to be small in warpage after curing, a resin film for an insulating film, an insulating film, and a printed wiring board provided with an insulating film. The resin composition for an insulating film contains at least: a (A) binder polymer; and (B) cross-linked polymer particles, whose polymer has a urethane bond and a carbonate skeleton in its molecule.

Resin composition for insulating film, and use thereof

An object of the present invention is to provide (a) a polyimide precursor solution which is curable at low temperatures (not more than 200&#xb0; C.) and which has excellent long-term storage stability, (b) a photosensitive resin composition, a photosensitive resin film, a thermosetting resin composition, and a polyimide insulating film, each of which is obtainable from the polyimide precursor solution and each of which is preferably usable as an insulating material for electric and electronic purposes, and (c) a printed wiring board provided with the insulating film. The above object is achievable by use of a polyimide precursor composition solution containing at least a partially imidized polyimide precursor having a urethane bond.

Polyimide precursor composition and use thereof

A conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film the electromagnetic-shielding conductive layer (A), the insulator film (B), and the wiring-pattern-equipped film (C) being laminated in this order, the insulator film (B) containing at least (a) a binder polymer and (b) spherical organic beads.

Flexible printed circuit integrated with conductive layer

A stiffener-integrated flexible printed circuit board includes: (A) a stiffener; (B) a thermosetting adhesive; (C) an insulator film; and (D) a wiring-pattern-equipped film, the stiffener (A), the thermosetting adhesive (B), the insulator film (C), and the wiring-pattern-equipped film (D) being laminated in this order, the insulator film (C) containing at least (a) a binder polymer and (b) spherical organic beads. This provides a stiffener-integrated FPC which is excellent in adhesion between a thermosetting adhesive of a stiffener and an insulator film and which is small in warpage.

Flexible printed circuit integrated with stiffener

The object of the present invention is to provide a photosensitive resin composition which is excellent in: storage stability in a long-term storage; microfabricability; developability; low-temperature curability; flexibility in a cured film; electrical insulation reliability; solder heat resistance; resistance to an organic solvent; and flame retardancy and low in post-curing warpage when processed into a substrate. The object can be attained by use of a photosensitive resin composition production kit which includes at least two or more components including an A component and a B component. The A component contains a (A) compound having a carboxyl group. The B component contains a (B) compound having a reactive group which is reactive to a carboxyl group, a (C) oxime ester photopolymerization initiator, and a (D) compound having a photosensitive group but no carboxyl group.

Photosensitive resin composition production kit, and use thereof

A conductive-layer-integrated flexible printed circuit includes: (A) an electromagnetic-shielding conductive layer; (B) a photosensitive resin composition layer; and (C) a wiring-pattern-equipped film, (A) the electromagnetic-shielding conductive layer, (B) the photosensitive resin composition layer, and (C) the a wiring-pattern-equipped film being laminated in this order, and (B) the photosensitive resin composition layer being formed from a photosensitive resin composition containing at least (a) carboxyl-group-containing resin, (b) a photo-polymerization initiator, and (c) thermosetting resin.

Conductive layer integrated FPC

The photosensitive resin composition contains a (A) binder polymer, (B) cross-linked polymer particles, (C) thermosetting resin, (D) photo-polymerization initiator, and a (E) phosphoric flame retardant, in which a content of the (B) cross-linked polymer particles is 30 parts by weight to 100 parts by weight with respect to the 100 parts by weight of the (A) binder polymer, and an average particle diameter of the (B) cross-linked polymer particles is 1 &#x3bc;m to 10 &#x3bc;m. Therefore, the photosensitive resin composition (i) obtains an excellent tack-free property after being applied and dried, (ii) can be subjected to fine processing, (iii) is formed into a cured film having excellent flexibility, flame retardancy, and electrical insulation reliability, and (iv) causes a substrate to have a small warpage after being cured.

The present invention provides an insulating film including: a (A) binder polymer; (B) spherical organic beads; and (C) fine particles containing at least one element selected from the group consisting of phosphorus, aluminum, and magnesium, both the (B) spherical organic bead and the (C) fine particles being dispersed in a predetermined state in the insulating film.

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Shiga, Japan

Yoshihide Sekito