This inventor holds 55 USPTO granted patents and 17 published patent applications and 12 EPO patents, primarily in Additive Manufacturing (CPC class G06F). Top assignees: Shanghai Tianma Micro-Electronics Co., Ltd., Tianma Micro-Electronics Co., Ltd., Intel Corporation. Active years: 2004-2026.
Inventors with similar research interests:
Location History:
- Hubei, CN (2019 - 2023)
- Shanghai, CN (2004 - 2024)
Company Filing History:
16 out of 774 
12 out of 680 
11 out of 56,184 
Years Active: 2004-2026
Areas of Expertise:
Title: Innovations of Yong Wu: A Look at His Patented Contributions
Introduction: Yong Wu, based in Shanghai, China, is a prolific inventor with a remarkable track record of 50 patents to his name. His work primarily centers around advancements in technology, particularly in the realms of memory management and additive manufacturing.
Latest Patents: Among his latest innovations is the patent for "Efficient Address Translation." This invention outlines a system comprising interface circuitry and programmable circuitry that reserves memory addresses for emulation of a guest system. The invention creatively addresses issues related to different instruction set architectures and facilitates memory access instructions for overflow and underflow scenarios, significantly improving system efficiency. Additionally, Yong Wu has developed a patent for "Forging Heads and Fixing Devices with Aligned Through-Holes and Cavities." This invention pertains to a forging head used in additive manufacturing, featuring a base portion and a forging portion designed to create a cladding layer. The design includes a through hole allowing energy beams or additive materials to pass through, optimizing the manufacturing process.
Career Highlights: Yong Wu has made significant contributions through his tenure at recognized companies, including Shanghai Tianma Micro-electronics Co., Ltd. and Tianma Micro-electronics Co., Ltd. His role in these organizations has been pivotal in shaping innovative solutions in the micro-electronics field.
Collaborations: Throughout his career, Yong Wu has collaborated with notable coworkers such as Jianhui Li and Xiao Dong Lin. These partnerships have undoubtedly facilitated the progression of his ideas and fostered a collaborative environment conducive to innovation.
Conclusion: With an impressive portfolio of 50 patents, Yong Wu continues to push the boundaries of technology and innovation. His latest patents on efficient address translation and advancements in additive manufacturing highlight his dedication to solving complex engineering challenges. As Yong Wu's career progresses, his contributions will likely remain significant in shaping the future of microelectronics and manufacturing.