Shanghai, China

Yong Wu

USPTO Granted Patents = 52 

 

Average Co-Inventor Count = 3.2

ph-index = 6

Forward Citations = 142(Granted Patents)

Forward Citations (Not Self Cited) = 138(Oct 12, 2025)


Inventors with similar research interests:


Location History:

  • Hubei, CN (2019 - 2023)
  • Shanghai, CN (2004 - 2024)

Company Filing History:

goldMedal16 out of 761 
 
Shanghai Tianma Micro-electronics Co., Ltd.
 patents
silverMedal12 out of 680 
 
Tianma Micro-electronics Co., Ltd.
 patents
bronzeMedal10 out of 54,664 
 
Intel Corporation
 patents
48 out of 51,873 
 
General Electric Company
 patents
52 out of 136 
 
Shanghai Bilibili Technology Co., Ltd.
 patents
62 out of 221 
 
Tongji University
 patents
72 out of 2 
 
Shanghai Allist Pharmaceuticals Co., Ltd.
 patents
82 out of 2 
 
Accela Chembio Co., Ltd.
 patents
91 out of 1 
 
Shanghai Guangwei Electric & Tools Co., Ltd
 patent
101 out of 1 
 
Shanghai Power Station Co., Ltd
 patent
111 out of 1 
 
Shanghai Greatway Top Power Co., Ltd
 patent
121 out of 1 
 
Shanghai Greatway Electric & Tools, Ltd.
 patent
131 out of 12 
 
Shanghai Allist Pharmaceuticals, Inc.
 patents
141 out of 1,608 
 
Novatek Microelectronics Corp.
 patents
151 out of 46 
 
Roche Innovation Center Copenhagen A/s
 patents
161 out of 207 
 
Baoshan Iron & Steel Co., Ltd.
 patents
171 out of 1 
 
Shanghai Hantong Medical Technology Co., Ltd.
 patent
183 out of 832,680 
Other
 patents
where one patent can have more than one assignee

Years Active: 2004-2025

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52 patents (USPTO):

Title: Innovations of Yong Wu: A Look at His Patented Contributions

Introduction: Yong Wu, based in Shanghai, China, is a prolific inventor with a remarkable track record of 50 patents to his name. His work primarily centers around advancements in technology, particularly in the realms of memory management and additive manufacturing.

Latest Patents: Among his latest innovations is the patent for "Efficient Address Translation." This invention outlines a system comprising interface circuitry and programmable circuitry that reserves memory addresses for emulation of a guest system. The invention creatively addresses issues related to different instruction set architectures and facilitates memory access instructions for overflow and underflow scenarios, significantly improving system efficiency. Additionally, Yong Wu has developed a patent for "Forging Heads and Fixing Devices with Aligned Through-Holes and Cavities." This invention pertains to a forging head used in additive manufacturing, featuring a base portion and a forging portion designed to create a cladding layer. The design includes a through hole allowing energy beams or additive materials to pass through, optimizing the manufacturing process.

Career Highlights: Yong Wu has made significant contributions through his tenure at recognized companies, including Shanghai Tianma Micro-electronics Co., Ltd. and Tianma Micro-electronics Co., Ltd. His role in these organizations has been pivotal in shaping innovative solutions in the micro-electronics field.

Collaborations: Throughout his career, Yong Wu has collaborated with notable coworkers such as Jianhui Li and Xiao Dong Lin. These partnerships have undoubtedly facilitated the progression of his ideas and fostered a collaborative environment conducive to innovation.

Conclusion: With an impressive portfolio of 50 patents, Yong Wu continues to push the boundaries of technology and innovation. His latest patents on efficient address translation and advancements in additive manufacturing highlight his dedication to solving complex engineering challenges. As Yong Wu's career progresses, his contributions will likely remain significant in shaping the future of microelectronics and manufacturing.

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