Cumberland Foreside, ME, United States of America

Yong Liu

This inventor holds 22 USPTO granted patents and 16 published patent applications and 2 EPO patents, primarily in Semiconductor Packaging. Top assignee: Semiconductor Components Industries, LLC. Active years: 2021-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yong Liu. Retrieved from https://idiyas.com/inventor/yong-liu-4ymgr67y

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 22 

% Patents Active = 90.9

 

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 12(Granted Patents)


Company Filing History:


Years Active: 2021-2026

Loading Chart...
Loading Chart...
Areas of Expertise:
Semiconductor Packages
Power Module
Dual-Side Cooling
Thermal Performance
Hybrid Spacer
Conductive-Bonding
Leadframe Spacer
Stress Reduction
Embedded Semiconductor Die
Three-Dimensional Substrates
22 patents (USPTO):Explore Patents

Title: **The Innovative Mind of Yong Liu**

Introduction

Yong Liu is an accomplished inventor based in Cumberland Foreside, Maine, with a remarkable portfolio of 16 patents. His work primarily focuses on advancements in semiconductor technology. Liu’s innovative approach has led to significant improvements in the thermal performance and efficiency of semiconductor devices.

Latest Patents

Yong Liu's latest patents underscore his expertise in semiconductor device modules. One notable patent addresses thermal performance improvement and stress reduction in semiconductor device modules. The invention involves a signal distribution assembly that employs a metal layer with both planar and non-planar sides, incorporating a unique design with a base portion and extending posts. This metal layer can be pre-molded with a thermally conductive insulator, enhancing the overall functionality of the device.

Another key patent involves a dual-side cooling (DSC) semiconductor package, consisting of a sophisticated structure with multiple metal-insulator-metal (MIM) substrates. These substrates facilitate effective heat dissipation and ensure reliable electrical connections within the semiconductor die, significantly advancing the technology in the industry.

Career Highlights

Liu's career is marked by his contributions to Semiconductor Components Industries, LLC, where he has played a pivotal role in developing innovative semiconductor solutions. His patents not only demonstrate technical proficiency but also reflect a deep understanding of industry needs and challenges.

Collaborations

Throughout his career, Yong Liu has collaborated with notable peers, including Liangbiao Chen and Yusheng Lin. The synergy among these inventors has fostered a creative environment, encouraging the development of groundbreaking technologies in the semiconductor field.

Conclusion

Yong Liu stands out as a leading figure in the realm of semiconductor innovation. His 16 patents illustrate a steadfast commitment to enhancing thermal performance and efficiency in technology. As the industry continues to evolve, Liu's contributions will undoubtedly shape the future of semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…