The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2023

Filed:

Mar. 18, 2022
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Liangbiao Chen, Scarborough, ME (US);

Yong Liu, Cumberland Foreside, ME (US);

Tzu-Hsuan Cheng, Scarborough, ME (US);

Stephen St. Germain, Gilbert, AZ (US);

Roger Arbuthnot, Mesa, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/3735 (2013.01); H01L 24/32 (2013.01); H05K 7/2089 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/84801 (2013.01); H01L 2924/13055 (2013.01);
Abstract

A power module includes a spacer block, a thermally conductive substrate coupled to one side of the spacer block, and a semiconductor device die coupled to an opposite side of the spacer block. The spacer block includes a solid spacer block and an adjacent flexible spacer block. An inner portion of the device die is coupled to the solid spacer block, and an outer portion of the semiconductor device die is coupled to the adjacent flexible spacer block.


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