Scarborough, ME, United States of America

Tzu-Hsuan Cheng


Average Co-Inventor Count = 3.7

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2021-2025

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6 patents (USPTO):

Title: Tzu-Hsuan Cheng: Innovator in Power Module Technology

Introduction

Tzu-Hsuan Cheng is a notable inventor based in Scarborough, ME (US). He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on innovative solutions for power modules, enhancing their efficiency and functionality.

Latest Patents

Cheng's latest patents include a structure and method related to a power module using a hybrid spacer. This method involves shaping a block of flexible spacer material to accommodate a solid metal block, which is then coupled to the spacer material. Another significant patent is for a leadframe spacer designed for double-sided power modules. This semiconductor device module features a leadframe spacer that serves both as a leadframe and a spacer, allowing for a double-sided cooling configuration. The leadframe surface provides a die attach pad (DAP) shared by multiple semiconductor devices, enhancing the overall design and efficiency.

Career Highlights

Tzu-Hsuan Cheng is currently employed at Semiconductor Components Industries, LLC, where he continues to innovate in the semiconductor field. His work has been instrumental in developing advanced technologies that improve power module performance.

Collaborations

Cheng collaborates with talented individuals such as Yong Liu and Liangbiao Chen, contributing to a dynamic team focused on cutting-edge semiconductor solutions.

Conclusion

Tzu-Hsuan Cheng's contributions to power module technology exemplify his innovative spirit and dedication to advancing semiconductor solutions. His patents reflect a commitment to improving efficiency and functionality in the industry.

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