The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2025
Filed:
Apr. 06, 2022
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US);
Abstract
In some aspects, the techniques described herein relate to a signal distribution assembly configured to conduct signals in a semiconductor device module, the signal distribution assembly including: a metal layer, the metal layer having: a first side, the first side being planar; and a second side opposite the first side, the second side being non-planar and including: a base portion; a first post extending from the base portion; and a second post extending from the base portion. The metal layer can be pre-molded using a molding compound disposed on the second side of the metal later, with respective surfaces of the first post and the second posted exposed through the molding compound, and or the metal layer can be coupled with a thermally conductive insulator (e.g., ceramic) layer.