Qing Yang

Title: Innovations in Semiconductor Technology by Qing Yang

Introduction: Qing Yang, an accomplished inventor based in Shenzhen, China, has made significant contributions to the field of semiconductor technology, holding an impressive total of 28 patents. His work focused on improving thermal performance and reducing stress in semiconductor device modules, positioning him as a key figure in technological advancements within this space.

Latest Patents: Among his latest innovations, Qing Yang developed a method for enhancing thermal performance and stress reduction in semiconductor device modules. His signal distribution assembly features a uniquely designed metal layer with both planar and non-planar surfaces, integrated with thermally conductive insulator layers to improve overall efficiency. Additionally, he introduced a dual-side cooling (DSC) semiconductor package that utilizes advanced metal-insulator-metal (MIM) substrate designs, ensuring optimal electrical coupling and reduced thermal stress for enhanced device reliability.

Career Highlights: Over the years, Qing Yang has worked with notable companies, including Shenzhen Futaihong Precision Industry Co., Ltd. and Sutech Trading Limited. His career has been marked by innovation and collaboration, driving advancements in semiconductor technology through his patented inventions.

Collaborations: Throughout his professional journey, Qing has collaborated with esteemed coworkers like Chia-Hua Chen and Yong Liu, contributing to a culture of innovation and excellence in the research and development of semiconductor devices.

Conclusion: Qing Yang's pioneering work in semiconductor technology has led to significant advancements through his patented inventions. With a focus on improved thermal performance and stress reduction, his contributions continue to influence the industry and inspire future innovations.