Shenzhen Futaihong Precision Industry Co., Ltd.

Sutech Trading Limited

Semiconductor Components Industries, LLC

Fih (Hong Kong) Limited

Shenzhen Dapu Microelectronics Co., Ltd.

Ne Plus Enterprises, LLC

Tencent Technology (Shenzhen) Company Limited

Huawei Technologies Co., Limited

Zte Corporation

Superd Co. Ltd.

Kuang-Chi Innovative Technology Ltd.

Qing Yang

Chia-Hua Chen

Jing Yang

Ruopeng Liu

Chee Hiong Chew

Juan Zheng

Yong Liu

Xiang Feng

Sixiang Chen

Wuping Chen

Lijun Qing

Lijun Zhu

Haibo He

Yushuang Yao

Fei Wang

Dengkun Xiao

Chunlin Ji

Hong Xia Li

Yutao Yue

Hong Li

Peiyun Jian

Vemmond Jeng Hung Ng

Ting Liao

Dongfang Li

Qi Tian

Yuxiang Zhang

Yijun Cui

Jianli Wang

Baiqing Zong

Xinzhu Li

Zhong Chen

Ceiling fan with light

In some aspects, the techniques described herein relate to a signal distribution assembly configured to conduct signals in a semiconductor device module, the signal distribution assembly including: a metal layer, the metal layer having: a first side, the first side being planar; and a second side opposite the first side, the second side being non-planar and including: a base portion; a first post extending from the base portion; and a second post extending from the base portion. The metal layer can be pre-molded using a molding compound disposed on the second side of the metal later, with respective surfaces of the first post and the second posted exposed through the molding compound, and or the metal layer can be coupled with a thermally conductive insulator (e.g., ceramic) layer.

Thermal performance improvement and stress reduction in semiconductor device modules

A dual-side cooling (DSC) semiconductor package includes a first metal-insulator-metal (MIM) substrate having a first insulator layer, first metallic layer, and second metallic layer. A second MIM substrate includes a second insulator layer, third metallic layer, and fourth metallic layer. The third metallic layer includes a first portion having a first contact area and a second portion, electrically isolated from the first portion, having a second contact area. A semiconductor die is coupled with the second metallic layer and is directly coupled with the third metallic layer through one or more solders, sintered layers, electrically conductive tapes, solderable top metal (STM) layers, and/or under bump metal (UBM) layers. The first contact area is electrically coupled with a first electrical contact of the die and the second contact area is electrically coupled with a second electrical contact of the die. The first and fourth metallic layers are exposed through an encapsulant.

Dual-side cooling semiconductor packages and related methods

A power module can include a casing mounted to a baseplate that contains a substrate with circuitry. The circuitry can include pins for coupling signals to/from the circuitry. These pins can extend through a cover portion of the casing so that an electronic substrate, such as a printed circuit board (PCB) can be press-fit onto the pins. When press-fit, the electronic substrate is supported and positioned by support pillars that extend from the base plate to above the cover portion of the casing. If the pins and the support pillars have different coefficients of thermal expansion, damage to connection points between the pins and the circuitry may occur. Here, a power module is disclosed that has thermally matched pins and support pillars so that when the system is thermally cycled over a range of temperatures, the connection points are not damaged by forces induced by thermal expansion.

Power module

The present disclosure discloses a control device of data storage system, including a host interface, a peer interface, a storage unit interface, a processor and a local data management module. The host interface is connected and communicated with a storage server for data interaction with the storage server. The peer interface is configured for data communication connection with a storage unit of an adjacent control device in the data storage system. The storage unit interface is configured to connect a storage unit. The local data management module is configured for local data management of the data in the storage unit according to the data management instruction via the processor. The host interface is configured to send result data of local data management to the storage server.

Control device of storage system

A method includes disposing a series of protrusions on a rectangular side panel of an open four-sided box-like structure in a frame, and attaching an electronic substrate to the frame. The electronic substrate carries one or more circuit components. The series of protrusions acts as a spring-like compensator to compensate plastic deformation, twisting or warping of the frame, and to limit propagation of stress to the electronic substrate via the frame.

Power module package casing with protrusion supports

The invention discloses a solid-state drive control device and a learning-based solid-state drive data access method, wherein the method comprises the steps of: presetting a hash table, the hash table comprising more than one hash value, the hash value is used to record and represent data characteristics of data pages in the solid-state drive. Obtaining an I/O data stream of the solid-state drive, and obtaining a hash value corresponding to the I/O data stream in the hash table. Predicting a sequence of data pages and/or data pages that are about to be accessed by a preset first learning model. Prefetching data is performed in the solid-state drive based on an output result of the first learning model. Through the embodiment of the present invention, when predicting prefetched data, learning can be performed in real time to adapt to different application categories and access modes through adaptive adjustment parameters, so that better data prefetching performance can be obtained.

Solid-state drive control device and learning-based solid-state drive data access method

Solid-state drives (SSD) and a data access method for SSD are provided. The method includes the following. Cache acquired data-to-be-written to a preset write cache module. Rank the data-to-be-written in the write cache module according to a least recently used page (LRU) algorithm. When data storage amount of the write cache module reaches a preset value, determine a preset number of replacement data among the infrequently used data-to-be-written according to a preset cache replacement algorithm. Write the replacement data into a flash memory of the SSD. Implementations of the present disclosure can decrease effectively the number of times of rewriting on a flash memory of the SSD, thereby reducing effectively a write amplifying problem of the SSD during data access.

Solid-state hard disk and data access method for use with solid-state hard disk

A non-antibiotic feed additive including various ingredients, including selenium and superoxide dismutase (SOD). Also provided is a feed including the feed additive.

Herbaceous selenium-enriched SOD non-antibiotic feed additive and method of use thereof

A method of preventing chicken white diarrhea and coccidiosis by providing a population of chickens an effective amount of a non-antibiotic feed, without feeding the chickens antibiotics. The feed includes a feed base and a feed additive. The feed additive can include various ingredients, including selenium and superoxide dismutase (SOD).

Herbaceous selenium-enriched SOD non-antibiotic feed and method of manufacture thereof

A non-antibiotic feed includes the following components by weight: 330-700 parts of corn, 140-230 parts of soybean meal, 80-210 parts of corn gluten meal, 35-150 parts of oil bran, 15-43 parts of rapeseed meal, 80-130 parts of wheat middling, and a feed additive. The feed additive can include various ingredients, including selenium and superoxide dismutase (SOD). The feed provides improved survival rate for poultry without using antibiotics.

Herbaceous selenium-enriched sod non-antibiotic feed and method of manufacture thereof

Embodiments of the present invention disclose a handover method and a related user equipment and system, which are used for handover judgment in a CoMP handover scenario. The method according to an embodiment of the present invention includes: obtaining a first reference signal parameter Mn of a target node in a macro neighboring cell and second reference signal parameters Mp corresponding to multiple nodes in a macro serving cell, where the macro serving cell is a cell serving a user equipment UE and the macro neighboring cell is a cell adjacent to the macro serving cell; selecting a preferred Mp that meets a predefined requirement from the Mps corresponding to the multiple nodes; and triggering a handover procedure if the preferred Mp and the Mn meet a preset handover condition. By implementing the solutions in the present invention, throughput of a communications system after a UE handover can be increased.

Method for handover judgment in coordinated multiple point

An object tracking method is provided. The method includes obtaining current position coordinates of a tracked object for a first time using a tracking algorithm and initializing a filter acting on a time-varying system based on the obtained current position coordinates. The method further includes updating a system state through the filter acting on the time-varying system when the tracking algorithm outputs new current position coordinates of the tracked object with a spatial delay and comparing speed of the tracked object to a compensation determination threshold. Further, the method includes when the speed of the tracked object is greater than the compensation determination threshold, compensating the new current position coordinates of the tracked object with the spatial delay through the filter acting on the time-varying system, and outputting the compensated current position coordinates.

Method and apparatus for object tracking and 3D display based thereon

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Shenzhen, China

Qing Yang