IDiyas

For the Inventor, By the Inventor

Tokyo, Japan

Yoko Nishino

USPTO Granted Patents = 22

Average Co-Inventor Count = 2.5

ph-index = 11

Forward Citations = 241(Granted Patents)


Location History:

  • Ota-ku, JP (2014 - 2015)
  • Tokyo, JP (2015 - 2020)

Company Filing History:

goldMedal22 out of 1,552 
 
Disco Corporation
 patents

Years Active: 2014-2020

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22 patents (USPTO):Explore Patents
1. 10625371 - Wafer producing method (2020-04-21),
2. 10369659 - Wafer producing method (2019-08-06),
3. 10357851 - Wafer producing method (2019-07-23),
4. 10319593 - Wafer thinning method (2019-06-11),
5. 10297438 - Water producing method (2019-05-21),
6. 10081076 - Wafer producing method (2018-09-25),
7. 10076804 - Wafer producing method (2018-09-18),
8. 9925619 - Wafer producing method (2018-03-27),
9. 9899262 - Wafer processing method (2018-02-20),
10. 9884390 - Wafer producing method (2018-02-06),
11. 9884389 - SiC ingot slicing method (2018-02-06),
12. 9808884 - Polycrystalline SiC wafer producing method (2017-11-07),
13. 9789565 - Wafer producing method (2017-10-17),
14. 9764428 - Wafer producing method (2017-09-19),
15. 9764420 - Wafer producing method (2017-09-19),

Title: Innovator Yoko Nishino: Pioneering Advances in Wafer Production

Introduction

Yoko Nishino, a prominent inventor based in Tokyo, Japan, has made significant contributions to the field of wafer production with an impressive portfolio of 22 patents. His innovative techniques have optimized the manufacturing processes for hexagonal single crystal wafers, essential components in various electronic devices.

Latest Patents

Among his latest patents, Nishino has developed a groundbreaking wafer producing method that utilizes a laser beam to create a hexagonal single crystal wafer from a hexagonal single crystal ingot. This method involves a sophisticated separation start point forming step, where a laser beam is applied to the ingot, forming a modified layer and cracks that facilitate the separation process. The precision in setting the focal point of the laser beam, alongside its polarization direction, enhances the efficiency of the wafer production. Another notable patent further refines this process by controlling the energy levels and repetition frequency of the laser application, ensuring the successful separation from the modified layer and improving yield and quality.

Career Highlights

Nishino’s career at Disco Corporation showcases his dedication to advancing wafer technology. His relentless pursuit of innovation has positioned him as a leader in the development of cutting-edge production techniques. With 22 patents to his name, Nishino continues to influence the industry with his inventions that address both efficiency and effectiveness in production processes.

Collaborations

Throughout his career, Nishino has worked closely with talented colleagues, including Kazuya Hirata and Kunimitsu Takahashi. These collaborations have fostered a creative environment that promotes the sharing of ideas and the enhancement of technology within Disco Corporation.

Conclusion

Yoko Nishino exemplifies the spirit of innovation in the realm of wafer production. His contributions, marked by a plethora of patents and collaborative efforts, signify his role as a pivotal figure in advancing manufacturing processes. As technology continues to evolve, Nishino’s work will undoubtedly play a significant role in the future of the electronics industry.

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