The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

Nov. 30, 2015
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Kazuya Hirata, Tokyo, JP;

Kunimitsu Takahashi, Tokyo, JP;

Yoko Nishino, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2014.01); C30B 29/36 (2006.01); C30B 29/40 (2006.01); B23K 26/53 (2014.01); B28D 5/00 (2006.01); B23K 26/08 (2014.01); B23K 26/0622 (2014.01); B23K 26/55 (2014.01); C30B 33/06 (2006.01); B23K 103/00 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0057 (2013.01); B23K 26/0006 (2013.01); B23K 26/006 (2013.01); B23K 26/0622 (2015.10); B23K 26/0823 (2013.01); B23K 26/0853 (2013.01); B23K 26/53 (2015.10); B23K 26/55 (2015.10); B28D 5/0011 (2013.01); C30B 29/36 (2013.01); C30B 29/406 (2013.01); C30B 33/06 (2013.01); B23K 2201/40 (2013.01); B23K 2203/56 (2015.10);
Abstract

A wafer producing method for producing a hexagonal single crystal wafer from a hexagonal single crystal ingot includes a separation start point forming step of setting the focal point of a laser beam inside the ingot at a predetermined depth from the upper surface of the ingot, which depth corresponds to the thickness of the wafer to be produced, and next applying the laser beam to the upper surface of the ingot while relatively moving the focal point and the ingot to thereby form a modified layer parallel to the upper surface of the ingot and cracks extending from the modified layer, thus forming a separation start point. In the separation start point forming step, the laser beam is applied to the ingot plural times with the focal point of the laser beam set at the modified layer previously formed, thereby separating the cracks from the modified layer.


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