The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

Feb. 04, 2016
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Kazuya Hirata, Tokyo, JP;

Yoko Nishino, Tokyo, JP;

Kunimitsu Takahashi, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28D 5/00 (2006.01); B23K 26/00 (2014.01); B23K 26/03 (2006.01); B23K 26/08 (2014.01); B23K 26/53 (2014.01); B23K 26/0622 (2014.01); B23K 101/40 (2006.01); B23K 26/70 (2014.01); B23K 103/00 (2006.01); C30B 29/36 (2006.01); C30B 29/40 (2006.01); C30B 33/06 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0622 (2015.10); B23K 26/0006 (2013.01); B23K 26/032 (2013.01); B23K 26/08 (2013.01); B23K 26/0853 (2013.01); B23K 26/53 (2015.10); B23K 26/702 (2015.10); B28D 5/0011 (2013.01); C30B 29/36 (2013.01); C30B 29/406 (2013.01); C30B 33/06 (2013.01); B23K 2101/40 (2018.08); B23K 2103/56 (2018.08);
Abstract

A hexagonal single crystal wafer is produced from a hexagonal single crystal ingot. The wafer producing method includes a separation start point forming step of setting the focal point of a laser beam having a transmission wavelength to the ingot inside the ingot at a predetermined depth from the upper surface of the ingot. The separation start point forming step includes a first step of forming the separation start point with a first power and a second step of setting the focal point at the modified layer previously formed in the first step and then applying the laser beam to the ingot with a second power higher than the first power at an increased repetition frequency in the condition where the energy per pulse of the laser beam is the same as that in the first step, thereby separating the cracks from the modified layer.


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