The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2018

Filed:

Feb. 04, 2016
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Kazuya Hirata, Tokyo, JP;

Yoko Nishino, Tokyo, JP;

Kunimitsu Takahashi, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2014.01); B23K 26/53 (2014.01); B23K 26/082 (2014.01); B28D 5/00 (2006.01); H01L 29/16 (2006.01); B23K 26/03 (2006.01); B23K 26/08 (2014.01); C30B 29/36 (2006.01); C30B 29/40 (2006.01); B23K 26/70 (2014.01); B23K 26/0622 (2014.01); C30B 33/06 (2006.01); B23K 103/00 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0057 (2013.01); B23K 26/0006 (2013.01); B23K 26/032 (2013.01); B23K 26/0622 (2015.10); B23K 26/08 (2013.01); B23K 26/0853 (2013.01); B23K 26/53 (2015.10); B23K 26/702 (2015.10); B28D 5/0011 (2013.01); C30B 29/36 (2013.01); C30B 29/406 (2013.01); C30B 33/06 (2013.01); B23K 2201/40 (2013.01); B23K 2203/56 (2015.10);
Abstract

A crystal wafer is produced from a hexagonal crystal ingot. A separation start point is formed by setting the focal point of a laser beam inside the ingot at a predetermined depth, which depth corresponds to the thickness of the wafer to be produced. The laser beam is applied to the upper surface of the ingot while relatively moving the focal point and the ingot to form a modified layer parallel to the upper surface of the ingot and cracks extending from the modified layer along a c-plane in the ingot, thus forming the separation start point. First the laser beam is scanned from a scanning start point to a scanning end point on the ingot. Then the laser beam is scanned from the scanning end point to the scanning start point. The first and second steps are alternately repeated to separate the cracks from the modified layer.


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