The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2020

Filed:

Apr. 01, 2016
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Kazuya Hirata, Tokyo, JP;

Kunimitsu Takahashi, Tokyo, JP;

Yoko Nishino, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2014.01); B23K 26/50 (2014.01); B28D 5/00 (2006.01); H01L 29/04 (2006.01); B23K 26/53 (2014.01); B23K 26/03 (2006.01); C30B 29/40 (2006.01); B23K 26/08 (2014.01); C30B 33/06 (2006.01); B23K 26/06 (2014.01); H01L 29/06 (2006.01); C30B 29/36 (2006.01); B23K 26/04 (2014.01); B23K 26/0622 (2014.01); B23K 103/00 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0006 (2013.01); B23K 26/032 (2013.01); B23K 26/04 (2013.01); B23K 26/0622 (2015.10); B23K 26/0626 (2013.01); B23K 26/0823 (2013.01); B23K 26/0853 (2013.01); B23K 26/0869 (2013.01); B23K 26/53 (2015.10); B28D 5/0011 (2013.01); C30B 29/36 (2013.01); C30B 29/406 (2013.01); C30B 33/06 (2013.01); H01L 29/045 (2013.01); H01L 29/06 (2013.01); B23K 2101/40 (2018.08); B23K 2103/56 (2018.08);
Abstract

A hexagonal single crystal wafer is produced from a hexagonal single crystal ingot. A wafer producing method includes a separation start point forming step of applying a laser beam to the ingot to form a modified layer parallel to the upper surface of the ingot and cracks extending from the modified layer, thus forming a separation start point. The focal point of the laser beam is relatively moved in a first direction perpendicular to a second direction where a c-axis in the ingot is inclined by an off angle with respect to a normal to the upper surface. The off angle is formed between the upper surface and a c-plane perpendicular to the c-axis, thereby linearly forming the modified layer extending in the first direction. The laser beam is applied to the ingot with the direction of the polarization plane of the laser beam set to the first direction.


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